Wednesday, April 2, 2014

Intel luncurkan berbagai solusi IoT di Intel Developer Forum 2014 Shenzhen


Dengan lanskap industri komputasi yang mengalami transformasi yang pesat, CEO Intel Brian Krzanich dalam pembukaan acara Intel Developer Forum (IDF) 2014 di Shenzhen, China, hari ini memaparkan rencana perusahaannya untuk membangun sejarah hampir 30 tahun di China, dan berkolaborasi dengan ekosistem teknologi yang terus tumbuh, khususnya di Shenzhen, untuk mempercepat inovasi baru dan membentuk kembali industri komputasi.

Selama keynote, Krzanich membahas bagaimana Intel dan ekosistem teknologi di Shenzhen dapat kembali memicu pertumbuhan - baik lokal dan global - dan memberikan produk komputasi dan pengalaman yang berbeda, yang mencakup beberapa segmen pasar, sistem operasi dan poin harga. Menggarisbawahi titik ini, ia mengumumkan pembentukan Intel Smart Device Innovation Center di Shenzhen dan pendanaan sebesar US$100 juta dari Intel Capital China Smart Device Innovatio Fund.

CEO Intel juga merinci beberapa produk baru dan teknologi dari perusahaannya yang akan mulai ditawarkan tahun ini, termasuk Intel® Edison, produk jadi, platform komputasi yang dihasilkan di laboratorium penelitian Intel di China. Dia juga mengumumkan ketersediaan Intel® Gateway Solutions untuk Internet of Things (IoT) berbasis prosesor Intel Quark™ dan Atom™, dan menunjukkan untuk pertama kalinya Sofia, platform SoC mobile Intel pertama yang yang terintegrasi untuk smartphone dan tablet murah.

Di hari pembukaan forum pengembang tahunan ini Krzanich bergabung dengan Ian Yang, presiden Intel China, yang membuka konferensi, dan Diane Bryant, wakil presiden senior dan general manager dari Intel Data Center Group, yang menjadi pembicara kunci untuk teknologi data center Intel sebagai dasar komputasi modern dan peluang bisnis yang muncul berkat adanya pertumbuhan perangkat cerdas yang terhubung.

"Ekosistem teknologi China akan berperan dalam transformasi komputasi," kata Krzanich. "Untuk membantu mendorong inovasi global, Intel akan tetap fokus pada memberikan kepemimpinan produk dan teknologi yang tidak hanya memungkinkan mitra kami untuk berinovasi dengan cepat, tetapi juga memenuhi janji bahwa 'jika itu komputasi, itu menjadi terbaik jika menggunakan Intel' - dari perangkat ke cloud, dan segala sesuatu di antaranya."


Investing in Innovation in China

Building on the company’s history of enabling and collaborating with customers to deliver innovative platforms, Intel will establish the Intel Smart Device Innovation Center in Shenzhen to accelerate the delivery of Intel technology-based devices to the China market and beyond.

The center will expand Intel’s work beyond tablets and provide local OEMs, ODMs, and software developers with access to Intel technology platforms and enabling support, including master reference designs for turnkey solutions, development tools, supply chain sourcing, quality management and customer support – acting as a bridge between product conception and commercial deployment.

Further accelerating this effort, Krzanich announced the US$100 million Intel Capital China Smart Device Innovation Fund focused on accelerating innovation of smart devices, including 2 in 1s, tablets, smartphones, wearables, IoT and other related technologies in China. The new investment reinforces Intel Capital’s commitment to the China IT industry and ecosystem development. Since 1998, Intel Capital has invested more than US$670 million in 110 companies in China across two already-established investment funds.

Velocity in Mobile Devices

As 4G LTE service expands in China, Intel is well-positioned to provide a growing share of LTE chipsets. Intel’s 2014 LTE platform, the Intel® XMM™ 7260, meets the five-mode requirement of China Mobile* today, including support for TD-LTE, and TD-SCDMA protocols required in China.

Intel is actively engaged in China for certification of the XMM 7260, paving the way for commercial availability in the second half of 2014 for performance and mainstream device market segments. Krzanich demonstrated the Intel XMM 7260 by conducting the first public, live call using China Mobile’s TD-LTE network, and spoke to strong ecosystem demand for a competitive LTE alternative.

Intel is also developing its SoFIA family of integrated mobile SoCs for entry and value smartphones and tablets. Krzanich demonstrated the family’s first silicon, booting up the new integrated Intel® Atom™ platform just months after adding the product to its ultra-mobile roadmap. He also noted the strategic opportunity these market segments present for Intel and the China technology ecosystems. Intel’s SoFIA 3G platform is on track to ship to OEMs in the fourth-quarter of 2014.

Krzanich also said that Intel is on track to ship 40 million tablets this year, and showcased a variety of innovative designs developed in China by OEMs and ODMs.

Enabling the Growing Internet of Things

Intel is actively pursuing a range of solutions, from the edge device to the cloud, to address the growing opportunities presented by IoT.

Krzanich announced availability of the Intel® Gateway Solutions for IoT, an integrated solution based on Intel Quark™ and Atom™ processors, in addition to an Intel® Galileo-based development platform. These platforms will help businesses reduce costs and offer new services by unlocking valuable data from legacy systems that traditionally haven’t had a means to communicate with each other and the cloud.

The first platforms integrate Wind River* and McAfee software to help accelerate time to market and will be available from the ecosystem this quarter. Customers developing gateway solutions include Shaspa* for energy and building automation, RocKontrol* for energy management, TransWiseway* and Vnomics* for transportation, and Zebra Technologies Corp* for locating solutions in retail, healthcare and manufacturing.

Turning to other smart, connected devices that help make up the IoT, Krzanich said Intel® Edison is on track for availability later this summer.

The Intel Edison disclosure in January drove enthusiastic responses from the pro maker and entrepreneurial communities as well as consumer electronics and industrial IoT companies. Krzanich said Intel is extending Intel® Edison to a family of development boards that will address a broader range of market segments and customer needs.

The first Intel® Edison board will now include use of Intel’s leading-edge 22nm Silvermont microarchitecture in development of a dual core Intel® Atom SoC, increased I/O capabilities and software support, and a new, simplified industrial design.

No comments:

Post a Comment